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Bonding and deep RIE: a powerful combination for high-aspect-ratio sensors and actuators

Author(s):
Hiller, K. ( Chemnitz Univ. of Technology (Germany) )
Kuchler, M. ( Fraunhofer Institute for Reliability and Microintegration (Germany) )
Billep, D. ( Chemnitz Univ. of Technology (Germany) )
Schroter, B. ( Chemnitz Univ. of Technology (Germany) )
Dienel, M. ( Chemnitz Univ. of Technology (Germany) )
Scheibner, D. ( Chemnitz Univ. of Technology (Germany) )
Gessner, T. ( Chemnitz Univ. of Technology (Germany) and Fraunhofer Institute for Reliability and Microintegration (Germany) )
2 more
Publication title:
Micromachining and Microfabrication Process Technology X
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5715
Pub. Year:
2005
Page(from):
80
Page(to):
91
Pages:
12
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819456892 [0819456896]
Language:
English
Call no.:
P63600/5715
Type:
Conference Proceedings

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