Bonding and deep RIE: a powerful combination for high-aspect-ratio sensors and actuators
- Author(s):
Hiller, K. ( Chemnitz Univ. of Technology (Germany) ) Kuchler, M. ( Fraunhofer Institute for Reliability and Microintegration (Germany) ) Billep, D. ( Chemnitz Univ. of Technology (Germany) ) Schroter, B. ( Chemnitz Univ. of Technology (Germany) ) Dienel, M. ( Chemnitz Univ. of Technology (Germany) ) Scheibner, D. ( Chemnitz Univ. of Technology (Germany) ) Gessner, T. ( Chemnitz Univ. of Technology (Germany) and Fraunhofer Institute for Reliability and Microintegration (Germany) ) - Publication title:
- Micromachining and Microfabrication Process Technology X
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 5715
- Pub. Year:
- 2005
- Page(from):
- 80
- Page(to):
- 91
- Pages:
- 12
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819456892 [0819456896]
- Language:
- English
- Call no.:
- P63600/5715
- Type:
- Conference Proceedings
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