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Through-hole processing of aluminum nitride and silicon wafers using short-pulse lasers

Author(s):
  • Deki, K. ( Ariake National College of Technology(Japan) )
  • Kanai, M. ( Osaka Univ. (Japan) )
  • Takizawa, H. ( Tokyo Cathode Lab. Co. , Ltd. (Japan) )
  • Matsuoka, F. ( Japan Atomic Energy Research Institute(Japan) )
  • Arisawa, T. ( Japan Atomic Energy Research Institute(Japan) )
Publication title:
Fifth International Symposium on Laser Precision Microfabrication : 11-14 May, 2004, Nara, Japan
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5662
Pub. Year:
2004
Page(from):
633
Page(to):
637
Pages:
5
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819456236 [0819456233]
Language:
English
Call no.:
P63600/5662
Type:
Conference Proceedings

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