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High-power diode laser bonding process between tape-carrier package and a glass panel with anisotropic conductive film

Author(s):
Nam, G. -J. ( Institute for Advanced Engineering(South Korea) )
Seo, M. -H. ( Institute for Advanced Engineering(South Korea) )
Hong, Y. -S. ( Institute for Advanced Engineering(South Korea) )
Lee, S. -U. ( Institute for Advanced Engineering(South Korea) )
Moon, S. -W. ( Institute for Advanced Engineering(South Korea) )
Ryu, K. -H. ( Univ. of Foreign Study(South Korea) )
Kwon, N. -I. ( Univ. of Foreign Study(South Korea) )
Kwak, N. -H. ( Jettech Ltd. (South Korea) )
3 more
Publication title:
Fifth International Symposium on Laser Precision Microfabrication : 11-14 May, 2004, Nara, Japan
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5662
Pub. Year:
2004
Page(from):
319
Page(to):
324
Pages:
6
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819456236 [0819456233]
Language:
English
Call no.:
P63600/5662
Type:
Conference Proceedings

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