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Exploration of a new wafer-level hermetic sealing method by Cu/Sn isothermal solidification technique for MEMS/NEMS devices

Author(s):
  • Du, M. ( Shanghai Institute of Microsystems and Information Technology (China) )
  • Xu, W. ( Shanghai Institute of Microsystems and Information Technology (China) )
  • Luo, L. ( Shanghai Institute of Microsystems and Information Technology (China) )
Publication title:
Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems II
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5650
Pub. Year:
2004
Page(from):
332
Page(to):
336
Pages:
5
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819456106 [0819456101]
Language:
English
Call no.:
P63600/5650
Type:
Conference Proceedings

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