Selective adhesive bonding with SU-8 for zero-level-packaging

Selective adhesive bonding with SU-8 for zero-level-packaging

Author(s):

Reuter, D. S. ( Technische Univ. Chemnitz (Germany) )
Bertz, A. ( Technische Univ. Chemnitz (Germany) )
Schwenzer, G. ( Technische Univ. Chemnitz (Germany) )
Gessner, T. ( Technische Univ. Chemnitz (Germany) and FhG IZM, Micro Devices and Equipment (Germany) )

Publication title:

Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems II

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5650

Pub. Year:

2004

Page(from):

163

Page(to):

171

Pages:

9

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819456106 [0819456101]

Language:

English

Call no.:

P63600/5650

Type:

Conference Proceedings

Details

TDL ID:	ZA00014867
Series ID:	PA00000029
Conf. info. (Name):	Smart Materials, Nano-, and Micro- Smart Systems : Micro- and Nanotechnology
Conf. info. (Number):	2004 : 2nd
Conf. info. (Venue):	Sydney, Australia
Conf. info. (Date):	2004.12.13-2004.12.15

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