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Wafer-level packaging of pressure sensor using SU8 photoresist

Author(s):
  • Iliescu, C. I. ( Institute of Biaengineering and Nanotechnology (Singapore) )
  • Tay, F. E. H. ( Institute of Bioengineering and Nanotechnology (Singapore) and National Univ. of Singapore (Singapore) )
  • Miao, J. ( Nanyang Technological Univ. (Singapore) )
  • Avram, M. ( National Institute for Research and Development in Microtechnologies (Romania) )
Publication title:
Smart structures, devices, and systems II : 13-15 December 2004, Sydney, Australia
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5649
Pub. Year:
2004
Page(from):
297
Page(to):
305
Pages:
9
Pub. info.:
Bellingham, Wash., USA: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819456090 [0819456098]
Language:
English
Call no.:
P63600/5649-1
Type:
Conference Proceedings

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