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Biopsy applications of Ti50Ni41 Cu9 shape memory films for wireless capsule endscope (Invited Paper)

Author(s):
Du, H. J. ( Singapore-Massachusetts Institute of Technology Alliance (Singapore) and Nanyang Technological Univ. (Singapore) )
Fu, Y. Q. ( Singapore-Massachusetts Institute Technology Alliance (Singapore) and Cambridge Univ. (United Kingdom) )
Zhang, S. ( Nanyang Technological Univ. (Singapore) )
Luo, J. K. ( Univ. of Cambridge (United Kingdom) )
Flewitt, A. J. ( Univ. of Cambridge (United Kingdom) )
Milne, W. I. ( Univ. of Cambridge (United Kingdom) )
1 more
Publication title:
Smart materials III : 13-15 December 2004, Sydney, Australia
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5648
Pub. Year:
2004
Page(from):
184
Page(to):
193
Pages:
10
Pub. info.:
Bellingham, Wash., USA: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819456083 [081945608X]
Language:
English
Call no.:
P63600/5648
Type:
Conference Proceedings

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