Simulating the effects of bake process parameters on resist thermal reflow
- Author(s):
- Lee, J. -W. ( Univ. of Wisconsin/Madison (USA) )
- Feng, Z. ( Univ. of Wisconsin/Madison (USA) )
- Engelstad, R. L. ( Univ. of Wisconsin/Madison (USA) )
- Lovell, E. G. ( Univ. of Wisconsin/Madison (USA) )
- Publication title:
- 24th Annual BACUS Symposium on Photomask Technology
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 5567
- Pub. Year:
- 2004
- Page(from):
- 1228
- Page(to):
- 1239
- Pages:
- 12
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819455130 [081945513X]
- Language:
- English
- Call no.:
- P63600/5567-2
- Type:
- Conference Proceedings
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