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Thermal de-embedding procedure for cryogenic on-wafer high-frequency noise measurement

Author(s):
Delcourt, S. ( Institut d'Electronique de Microelectronique et de Nanotechnologie (France) )
Dambrine, G. ( Institut d'Electronique de Microelectronique et de Nanotechnologie (France) )
Bourzgui, N. E. ( Institut d'Electronique de Microelectronique et de Nanotechnologie (France) )
Danneville, F. ( Institut d'Electronique de Microelectronique et de Nanotechnologie (France) )
Laporte, C. ( Ctr. National d'Etudes Spatiales (France) )
Fraysse, J.-P. ( Alcatel Space (France) )
Maignan, M. ( Alcatel Space (France) )
2 more
Publication title:
Noise in devices and circuits II : 26-28 May 2004, Maspalomas, Gran Canaria, Spain
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5470
Pub. Year:
2004
Page(from):
414
Page(to):
421
Pages:
8
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819453969 [081945396X]
Language:
English
Call no.:
P63600/5470
Type:
Conference Proceedings

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