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Real-time monitoring of thickness of silicon membrane during wet etching using a novel surface acoustic wave sensor

Author(s):
Lee, C. Y. ( National Taiwan Univ. (Taiwan) )
Wu, T. T. ( National Taiwan Univ. (Taiwan) )
Chen, Y. Y. ( National Taiwan Univ. (Taiwan) )
Cheng, Y. C. ( National Taiwan Univ. (Taiwan) )
Chen, W. J. ( National Taiwan Univ. (Taiwan) )
Pao, S. Y. ( National Taiwan Univ. (Taiwan) )
Chang, P. Z. ( National Taiwan Univ. (Taiwan) )
Chen, P. H. ( National Taiwan Univ. (Taiwan) )
Yen, K. H. ( National Taiwan Univ. (Taiwan) )
Xiao, F. Y. ( National Taiwan Univ. (Taiwan) )
5 more
Publication title:
MEMS, MOEMS, and Micromachining
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5455
Pub. Year:
2004
Page(from):
319
Page(to):
330
Pages:
12
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819453785 [0819453781]
Language:
English
Call no.:
P63600/5455
Type:
Conference Proceedings

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