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Flip-chip assembly for photonic circuits

Author(s):
Worhoff, K. ( Univ. Twente (Netherlands) )
Heideman, R. G. ( Mierij Meteo BV (Netherlands) )
Gilde, M. J. ( Lionix BV (Netherlands) )
Blidegn, K. ( Hymite A/S (Denmark) )
Heschel, M. ( Hymite A/S (Denmark) )
van den Vlekkert, H. ( Lionix BV (Netherlands) )
1 more
Publication title:
Micro-Optics: Fabrication, Packaging, and Integration
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5454
Pub. Year:
2004
Page(from):
9
Page(to):
20
Pages:
12
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819453778 [0819453773]
Language:
English
Call no.:
P63600/5454
Type:
Conference Proceedings

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