Evaluation of the impact of pattern fidelity on photomask inspectability

Evaluation of the impact of pattern fidelity on photomask inspectability

Author(s):

Woolverton, K. S. ( Intel Corp. (USA) )
Liu, C. ( Intel Corp. (USA) )
Zwigl, P. ( Intel Corp. (USA) )
Ruch, W. ( KLA-Tencor Corp. (USA) )

Publication title:

Photomask and X-Ray Mask Technology VI

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3748

Pub. Year:

1999

Page(from):

520

Page(to):

527

Pages:

8

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819432308 [081943230X]

Language:

English

Call no.:

P63600/3748

Type:

Conference Proceedings

Details

TDL ID:	ZA00014623
Series ID:	PA00000029
Conf. info. (Name):	Photomask and Next Generation Lithography Mask Technology : Photomask and X-Ray Mask Technology
Conf. info. (Number):	1999 : 6th
Conf. info. (Venue):	Yokohama, Japan
Conf. info. (Date):	1999.04.13-1999.04.14

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