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Thickness Effect On Nickel Silicide Formation And Thermal Stability For Ultra Shallow Junction CMOS

Author(s):
Zhao, F.F.
Shen, Z.X.
Zheng, J.Z.
Gao, W.Z.
Osipowicz, T.
Pang, C.H.
Lee, P.S.
See, A.K.
3 more
Publication title:
Silicon materials - processing characterization and reliability : symposium held April 1-5, 2002, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
716
Pub. date:
2002
Page(from):
41
Page(to):
46
Pages:
6
Pub. info.:
Warrendale: Materials Research Society
ISSN:
02729172
ISBN:
9781558996526 [1558996524]
Language:
English
Call no.:
M23500/716
Type:
Conference Proceedings

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