Thickness Effect On Nickel Silicide Formation And Thermal Stability For Ultra Shallow Junction CMOS
- Author(s):
Zhao, F.F. Shen, Z.X. Zheng, J.Z. Gao, W.Z. Osipowicz, T. Pang, C.H. Lee, P.S. See, A.K. - Publication title:
- Silicon materials - processing characterization and reliability : symposium held April 1-5, 2002, San Francisco, California, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 716
- Pub. Year:
- 2002
- Page(from):
- 41
- Page(to):
- 46
- Pages:
- 6
- Pub. info.:
- Warrendale: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558996526 [1558996524]
- Language:
- English
- Call no.:
- M23500/716
- Type:
- Conference Proceedings
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