Reverse Stress Relaxation In Cu Thin Films

Reverse Stress Relaxation In Cu Thin Films

Author(s):

Publication title:

Dislocations and deformation mechanisms in thin films and small structures : symposium held April 17-19, 2001, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

673

Pub. Year:

2001

Pages:

6

Pub. info.:

Warrendale, PA: Materials Research Society

ISSN:

02729172

ISBN:

9781558996090 [1558996095]

Language:

English

Call no.:

M23500/673

Type:

Conference Proceedings

Details

TDL ID:	ZA00014556
Series ID:	PA00000011
Conf. info. (Name):	Symposium On Dislocations and Deformation Mechanisms in Thin Films and Small Structures
Conf. info. (Number):	2001
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	2001.04.17-2001.04.19

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