Crystallographic Texture Characterization of Inlaid Copper Interconnects

Crystallographic Texture Characterization of Inlaid Copper Interconnects

Author(s):

Publication title:

Mechanisms of surface and microstructure evolution in deposited films and film structures : symposium held April 17-20, 2001, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

672

Pub. Year:

2001

Pages:

6

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558996083 [1558996087]

Language:

English

Call no.:

M23500/672

Type:

Conference Proceedings

Details

TDL ID:	ZA00014555
Series ID:	PA00000011
Conf. info. (Name):	Symposium On Mechansims of Surface and Microstructure Evolution in Deposited Films and Film Structures
Conf. info. (Number):	2001
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	2001.04.17-2001.04.20

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