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Effect of pH on Chemical-Mechanical Polishing of Copper and Tantalum

Author(s):
Publication title:
Chemical-mechanical polishing 2001 -- advances and future challenges : symposium held April 18-20, 2001, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
671
Pub. Year:
2001
Pages:
6
Pub. info.:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558996076 [1558996079]
Language:
English
Call no.:
M23500/671
Type:
Conference Proceedings

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