Analysis of Copper to Tantalum Transition in Copper CMP
- Author(s):
- Publication title:
- Chemical-mechanical polishing 2001 -- advances and future challenges : symposium held April 18-20, 2001, San Francisco, California, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 671
- Pub. Year:
- 2001
- Pages:
- 6
- Pub. info.:
- Warrendale, PA: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558996076 [1558996079]
- Language:
- English
- Call no.:
- M23500/671
- Type:
- Conference Proceedings
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