The Adsorption Behaviors of Citric Acid on Abrasive Particles in Cu CMP Slurry

The Adsorption Behaviors of Citric Acid on Abrasive Particles in Cu CMP Slurry

Author(s):

Publication title:

Chemical-mechanical planarization - integration technology and realiability : symposium held March 28-31, 2005, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

867

Pub. Year:

2005

Page(from):

153

Page(to):

158

Pages:

6

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558998209 [1558998209]

Language:

English

Call no.:

M23500/867

Type:

Conference Proceedings

Details

TDL ID:	ZA00014510
Series ID:	PA00000011
Conf. info. (Name):	MRS Spring Meeting
Conf. info. (Number):	2005
Conf. info. (Venue):	San Francisco, California, U.S.A.
Conf. info. (Date):	2005.03.28-2005.03.31

Similar Items:

1 Conference Proceedings Effect of Corrosion Inhibitor (BTA) in Citric Acid Based Slurry on Cu CMP Kim, In-Kwon, Kang, Young-Jae, Hong, Yi-Koan, Park, Jin-Goo Materials Research Society	7 Conference Proceedings Effects of Additives in KOH Based Electrolytes on Cu ECMP Tae-Young Kwon, In-Kwon Kim, Jin-Goo Park Materials Research Society
2 Conference Proceedings Frictional Behavior and Particle Adhesion of Abrasive Particles during Cu CMP Hong, Yi-Koan, Han, Ja-Hyung, Song, Jae-Hoon, Park, Jin-Goo Materials Research Society	8 Conference Proceedings Physical and Chemical Characterization of Re-Used Oxide CMP Slurry Kim, Hyung-Joon, Fom, Dae-Hong, Kim, Myoung-Shik, Park, Jin-Goo Electrochemical Society
3 Conference Proceedings The Adhesion of Pad Particles on Wafer Surfaces during Cu CMP Song, Jae-Hoon, Han, Ja-Hyung, Hong, Yi-Koan, Kang, Young-Jae, Park, Jin-Goo, Maeng, Ju-Ho, Won, Young-Man Materials Research Society	9 Conference Proceedings EFFECT OF CORROSION INHIBITOR, lH-BENZOTRJAZOLE (BTAH) ON PARTICLE ADHESION IN Cu CMP J.-H. Song, Y.-K. Hong, T.-G. Kim, Y.-J. Kang, I.-K. Kim, J.-H. Han, J.-G. Park, A. A. Busnaina Electrochemical Society
4 Conference Proceedings Effect of Wettability of Poly Silicon on CMP Behavior Young-Jae Kang, Bong-Kyun Kang, In-Kwon Kim, Jin-Goo Park, Yi-Koan Hong, Sang-Yeob Han, Seong-Kyu Yun, Bo-Un Yoon, … Materials Research Society	10 Conference Proceedings Electrochemical and Frictional Behaviors of Cu Surface in Organic Acid Based Slurries During Copper CMP Eom, D.-H., Ryu, J.-S., Hong, Y.-K., Myung, J.-J., Kim, K.-S., Park, J.-G. Electrochemical Society
5 Conference Proceedings Effect of Organic Acids in Slurry on Copper CMP Eom, Dae-Hong, Kim, Hyung-Joon, Song, Hyung-Soo, Park, Jin-Goo Electrochemical Society	11 Conference Proceedings THE EFFECTS OF pH ADJUSTORS IN POST Cu CMP CLEANING SOLUTIONS ON PARTICLE ADHESION AND REMOVAL Y.-K. Hong, J.-H. Song, Y.-J. Kang, I.-K. Kim, J.-G. Park, H.-S. Song, K.-S. Kim, J.-J. Myung, H.-J. Lee, S.-Y. Song Electrochemical Society
6 Conference Proceedings Development and Optimization of Slurry for Ru CMP In-Kwon Kim, Tae-Young Kwon, Jin-Goo Park, Hyung-Soon Park Materials Research Society	12 Conference Proceedings Passivation and Etching Behaviors of Copper Surface in Copper CMP Slurries Eom, D.-H., Hong, Y.-K., Lee, S.-H., Park, J.-Y., Myung, J.-J., Park, J.-G., Kim, K.-S., Song, H.-S., Park, H.-S., Choi, … Electrochemical Society

1

2

3

4

5

6

7

8

9

10

11

12