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Integration of CMP Fixed Abrasive Polishing into the Manufacturing of Thick Film SOI Substrates

Author(s):
Kulawski, Martin
Luoto, Hannu
Henttinen, Kimmo
Suni, Tommi
Weimar, Frauke
Makinen, Jari
1 more
Publication title:
Chemical-mechanical planarization - integration technology and realiability : symposium held March 28-31, 2005, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
867
Pub. Year:
2005
Page(from):
111
Page(to):
116
Pages:
6
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558998209 [1558998209]
Language:
English
Call no.:
M23500/867
Type:
Conference Proceedings

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