Blank Cover Image

Novel Use of Surfactants in Copper Chemical Mechanical Polishing (CMP)

Author(s):
Publication title:
Chemical-mechanical planarization - integration technology and realiability : symposium held March 28-31, 2005, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
867
Pub. Year:
2005
Page(from):
41
Page(to):
46
Pages:
6
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558998209 [1558998209]
Language:
English
Call no.:
M23500/867
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Role of Molecular Structure of Complexing/Chelating Agents in Copper CMP Slurries

Patri, Udaya B., Pandija, S., Babu, S.V.

Materials Research Society
7 Conference Proceedings Comparison of Glycine and Citric Acid as Complexing Agents in Copper Chemical-Mechanical Polishing Slurries

Gorantla, Venkata, Babu, S. V.

Materials Research Society
2 Conference Proceedings Study of Slurry Composition Transition in a Rotary Copper CMP Process

Hegde, Sharath, Patri, Udaya B., Jindal, Anurag, Babu, S. V.

Materials Research Society
8 Conference Proceedings Electrochemical Studies of Copper Chemical Mechanical Polishing Mechanism: Effects of Oxidizer Concentration

Lu, J., Garland, J. E., Petite, C. M., Babu, S. V., Roy, D.

Materials Research Society
3 Conference Proceedings Role of Chemicals and Abrasive Particle Properties in Chemical-Mechanical Polishing of Copper and Tantalum

Li, Y., Jindal, A., Babu, S.V.

Electrochemical Society
9 Conference Proceedings Slurry Retention and Transport During Chemical-Mechanical Polishing of Copper

Jindal, Anurag, Li, Ying, Narayanan, Satish, Bobu, S.V.

Materials Research Society
4 Conference Proceedings Effect of pH on Chemical-Mechanical Polishing of Copper and Tantalum

Jindal, Anurag, Li, Ying, Babu, S.V.

Materials Research Society
10 Conference Proceedings Chemical Mechanical Polishing of Copper Using Silica Slurry

Kondo, S., Sakuma, N., Homma, Y., Ohashi, N.

Electrochemical Society
5 Conference Proceedings Copper Dissolution and Chemical-Mechanical Polishing in Acidic Media

Luo, Q., Campbell, D.R., Babu, S.V.

Electrochemical Society
11 Conference Proceedings Use of Malonic Acid in Chemical Mechanical Polishing (CMP) of Tungsten

Zhang, L., Raghavan, S.

MRS - Materials Research Society
6 Conference Proceedings Study of Inhibition Characteristics of Slurry Additives in Copper CMP Using Force Spectroscopy

M. K. Keswani, H. Lee, S. Babu, U. Patri, Y. Hong, L. Economikos, M. Goldstein, L. Borucki, A. Philipossian, Y. Zhuang

Electrochemical Society
12 Conference Proceedings Modeling of Polishing Regimes in Chemical Mechanical Polishing

Yeruva, Suresh B., Park, Chang-Won, Moudgil, Brij M.

Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12