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The Adhesion of Pad Particles on Wafer Surfaces during Cu CMP

Author(s):
Song, Jae-Hoon
Han, Ja-Hyung
Hong, Yi-Koan
Kang, Young-Jae
Park, Jin-Goo
Maeng, Ju-Ho
Won, Young-Man
2 more
Publication title:
Chemical-mechanical planarization - integration technology and realiability : symposium held March 28-31, 2005, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
867
Pub. date:
2005
Page(from):
35
Page(to):
40
Pages:
6
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558998209 [1558998209]
Language:
English
Call no.:
M23500/867
Type:
Conference Proceedings

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