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Effects of Bonding Process Parameters on Wafer-to-Wafer Alignment Accuracy in Benzocyclobutene (BCB) Dielectric Wafer Bonding.

Author(s):
Niklaus, F.
Kumar, R.J.
McMahon, J.J.
Yu, J.
Matthias, T.
Wimplinger, M.
Lindner, P.
Lu, J.-Q.
Cale, T.S.
Gutmann, R.J.
5 more
Publication title:
Materials, technology and reliability of advanced interconnects - 2005 : symposium held March 28-April 1, 2005, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
863
Pub. Year:
2005
Page(from):
393
Page(to):
398
Pages:
6
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558998162 [1558998160]
Language:
English
Call no.:
M23500/863
Type:
Conference Proceedings

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