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Multi-Via Electromigration Test Structures for Identification and Characterization of Different Failure Mechanisms

Author(s):
Choi, Z.-S.
Chang, C.W.
Lee, J.H.
Gan, C.L.
Thompson, C.V.
Pey, K.L.
Choi, W.K.
2 more
Publication title:
Materials, technology and reliability of advanced interconnects - 2005 : symposium held March 28-April 1, 2005, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
863
Pub. Year:
2005
Page(from):
271
Page(to):
276
Pages:
6
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558998162 [1558998160]
Language:
English
Call no.:
M23500/863
Type:
Conference Proceedings

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