200mm Silicon Wafer-to-Wafer Bonding with Thin Ti Layer under BEOL-Compatible Process Conditions
- Author(s):
- Publication title:
- Surface engineering 2004 - fundamentals and applications : symposium held November 30-December 2, 2004, Boston, Massachusetts, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 843
- Pub. Year:
- 2005
- Page(from):
- 305
- Page(to):
- 310
- Pages:
- 6
- Pub. info.:
- Warrendale, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558997912 [1558997911]
- Language:
- English
- Call no.:
- M23500/843
- Type:
- Conference Proceedings
Similar Items:
1
Conference Proceedings
Evaluation of Thin Dielectric-Glue Wafer-Bonding for Three Dimensional Integrated Circuit-Applications
Materials Research Society |
Materials Research Society |
Electrochemical Society |
Materials Research Society |
3
Conference Proceedings
Effects of Bonding Process Parameters on Wafer-to-Wafer Alignment Accuracy in Benzocyclobutene (BCB) Dielectric Wafer Bonding.
Materials Research Society |
Materials Research Society |
4
Conference Proceedings
Dielectric Glue Wafer Bonding and Bonded Wafer Thinning for Wafer-Level 3D Integration
Electrochemical Society |
Materials Research Society |
Electrochemical Society |
11
Conference Proceedings
Low-Temperature PETEOS-to-PETEOS Wafer Bonding Using Titanium as Bonding Intermediate
Materials Research Society |
Materials Research Society |
Materials Research Society |