200mm Silicon Wafer-to-Wafer Bonding with Thin Ti Layer under BEOL-Compatible Process Conditions

200mm Silicon Wafer-to-Wafer Bonding with Thin Ti Layer under BEOL-Compatible Process Conditions

Author(s):

Publication title:

Surface engineering 2004 - fundamentals and applications : symposium held November 30-December 2, 2004, Boston, Massachusetts, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

843

Pub. date:

2005

Page(from):

305

Page(to):

310

Pages:

6

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558997912 [1558997911]

Language:

English

Call no.:

M23500/843

Type:

Conference Proceedings

Details

TDL ID:	ZA00014496
Series ID:	PA00000011
Conf. info. (Name):	Symposium on surface engineering
Conf. info. (Number):	2004
Conf. info. (Venue):	Boston, MA, USA
Conf. info. (Date):	2004.11.30-2004.12.02

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