Blank Cover Image

Three Dimensional Integration with Benzocyclobutene as the Wafer-Bonding Medium

Author(s):
Publication title:
Materials, integration and packaging issues for high-frequency devices
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
833
Pub. Year:
2004
Page(from):
87
Page(to):
92
Pages:
6
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558997813 [1558997814]
Language:
English
Call no.:
M23500/833
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Three-Dimensional Integration with Copper Wafer Bonding*

Fan, A., Reif, R.

Electrochemical Society
7 Conference Proceedings Effects of Softbake Parameters on a Benzocyclobutene (BCB) Adhesive Wafer Bond

Pascual, Daniel N.

Materials Research Society
2 Conference Proceedings A Silicon Nitride Based Shallow Trench Isolation with Side-Gate for CMOS Integration with MEMS Components for System-On-Chip Applications

Gokirmak, Ali, Tiwari, Sandip

Materials Research Society
8 Conference Proceedings Variable Thickness IPMC: Capacitance Effect on Energy Harvesting

Kwang Kim, Rashi Tiwari, Sang-Mun Kim

Materials Research Society
3 Conference Proceedings FULL THREE DIMENSIONAL MICROCIRCUIT INTEGRATION TECHNIQUES USING WAFER BONDING

D.B. Booth, C.B. Hunt, S. Mani, S. Glenn

Electrochemical Society
9 Conference Proceedings Low Temperature Integration of CdZnTe(211)B/Si(100) by Wafer Bonding

Huang, J., Cha, D.K., Kaleczyc, A., Dinan, J.H., Carpenter, R.W., Kim, M.J.

Electrochemical Society
4 Conference Proceedings Wafer Bonding Using Low-k Dielectrics aa Bonding Glue in Three-Dimensional Integration

Kwon, Y., Lu, J.-Q., Gutmann, R.J., Kraft, R.P., McDonald, J., Cale, T.S.

Electrochemical Society
10 Conference Proceedings Planarization Issues in Wafer-Level Three-Dimensional (3D) Integration

Lu, J.-Q., Rajagopalan, G., Gupta, M., Cale, T.S., Gutmann, R.J.

Materials Research Society
5 Conference Proceedings Micrometer Scale Silicon Dioxide Tunnels for On-chip Fluidic Sample Delivery to Nanometer-scale Chemical Sensors

Gokirmak, Ali, Sandip, Tiwari,

Materials Research Society
11 Conference Proceedings Three-Dimensional Integration Technology Based on Self-Assembled Chip-to-Wafer Stacking

Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Materials Research Society
6 Conference Proceedings Effects of Bonding Process Parameters on Wafer-to-Wafer Alignment Accuracy in Benzocyclobutene (BCB) Dielectric Wafer Bonding.

Niklaus, F., Kumar, R.J., McMahon, J.J., Yu, J., Matthias, T., Wimplinger, M., Lindner, P., Lu, J.-Q., Cale, T.S., …

Materials Research Society
12 Conference Proceedings Investigations of Silicon Nano-Crystal Floating Gate Memories

Kumar, Arvind, Welser, Jeffrey J., Tiwari, Sandip, Rana, Farhan, Chan, Kevin K.

Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12