Planarization Issues in Wafer-Level Three-Dimensional (3D) Integration

Planarization Issues in Wafer-Level Three-Dimensional (3D) Integration

Author(s):

Publication title:

Advances in chemical-mechanical polishing : symposium held April 13-15, 2004, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

816

Pub. Year:

2004

Page(from):

217

Page(to):

230

Pages:

14

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558997660 [1558997660]

Language:

English

Call no.:

M23500/816

Type:

Conference Proceedings

Details

TDL ID:	ZA00014458
Series ID:	PA00000011
Conf. info. (Name):	Symposium on advances in chemical-mechanical polishing
Conf. info. (Number):	2004
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	2004.04.13-2004.04.15

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