Blank Cover Image

Modeling of Pattern Density Dependent Pressure Non-Uniformity at a Die Scale for ILD Chemical Mechanical Planarization

Author(s):
Publication title:
Advances in chemical-mechanical polishing : symposium held April 13-15, 2004, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
816
Pub. Year:
2004
Page(from):
101
Page(to):
106
Pages:
6
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558997660 [1558997660]
Language:
English
Call no.:
M23500/816
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Micro Feature Pad Development and Its Performance in Chemical Mechanical Planarization

Lee, Sunghoon, Dornfeld, David A.

Materials Research Society
7 Conference Proceedings Yield Improvement via Minimization of Step Height Non-Uniformity in Chemical Mechanical Planarization (CMP)

Kadavasal, Muthukkumar, Eamkajornsiri, Sutee, Chandra, Abhijit, Bastawros, Ashraf F.

Materials Research Society
2 Conference Proceedings Integrated Tribo-Chemical Modeling of Copper CMP

Fiona M. Doyle, Shantanu Tripathi, Seungchoun Choi, David A. Dornfeld

Materials Research Society
8 Conference Proceedings Low-k Dielectric Material Chemical Mechanical Polishing Process Monitoring Using Acoustic Emission

Tang, Jianshe, Unger, Carsten, Moon, Yongsik, Dornfeld, David

MRS - Materials Research Society
3 Conference Proceedings Chemical-Mechanical Planarization Issues in Patterning Copper and Aluminum Interconnects with Magnetic Liners

Gutmann, Ronald J., Wang, Bin, Lee, Byung-Chan, Paul Chow, T., Duquette, David J.

Electrochemical Society
9 Conference Proceedings Interplay Between Copper Electroplating and Chemical Mechanical Planarization

Watts, David K., Chikamori, Yusuke, Kohama, Tatsuya, Kimura, Norio, Mishima, Koji, Hongo, Akihisa

Materials Research Society
4 Conference Proceedings A Wafer-scale Removal Rate Model For Chemical Mechanical Planarization

John Kelchner

American Institute of Chemical Engineers
10 Conference Proceedings An Electrochemical Mechanism of Copper Removal During Chemical Mechanical Planarization

Sainio, Carlyn, Duquette, David J.

Electrochemical Society
5 Conference Proceedings A Wafer-scale Removal Rate Model For Chemical Mechanical Planarization

John Kelchner

American Institute of Chemical Engineers
11 Conference Proceedings On the Pattern Dependency and Substrate Effects During Chemical-Mechanical Planarization for ULSI Manufacturing

Lin, C-F., Niu, J. J-L., Tseng, W-T.

Materials Research Society
6 Conference Proceedings A Multi-Scale Elasto-Hydrodynamic Contact Model of Chemical Mechanical Planarization

Kim, A., Tichy, J.A., Cale, T.S.

Electrochemical Society
12 Conference Proceedings Wafer-scale modeling of pattern effect in oxide chemical mechanical polishing

Ouma,D., Stine,B., Divecha,R., Boning,D., Chung,J., Shinn,G.B., Ali,I., Clark,J.

SPIE-The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12