Blank Cover Image

Fatal Void Size Comparisons in Via-Below and Via-Above Cu Dual-Damascene Interconnects

Author(s):
Choi, Z.-S.
Gan, C.L.
Wei, F.
Thompson, C.V.
Lee, J.H.
Pey, K.L.
Choi, W.K.
2 more
Publication title:
Materials, technology and reliability for advanced interconnects and low-k dielectrics - 2004 : symposium held April 13-15, 2004, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
812
Pub. Year:
2004
Page(from):
373
Page(to):
378
Pages:
6
Pub. info.:
Warrendale: Materials Research Society
ISSN:
02729172
ISBN:
9781558997622 [1558997628]
Language:
English
Call no.:
M23500/812
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Length Effects On The Reliability Of Dual-Damascene Cu Interconnects

Wei, F., Gan, C.L., Thompson, C.V., Clement, J.J., Hau-Riege, S.P., Pey, K.L., Choi, W.K., Tay, H.L., Yu, B., …

Materials Research Society
7 Conference Proceedings Reliability Issues for Submicron Interconnects and Vias

Thompson, C.V.

Electrochemical Society
2 Conference Proceedings Mortality Dependence of Cu Dual Damascene Interconnects on Adjacent Segment

Chang, C.W., Gan, C.L., Thompson, C.V., Pey, K.L., Choi, W.K., Hwang, N.

Materials Research Society
8 Conference Proceedings Stressmigration Studies on Dual Damascene Cu/Oxide and Cu/Low-k Interconnects

Baek, Won-Chong, Ho, Paul S., Lee, Jeong Gun, Hwang, Sung Bo, Choi, Kyeong-Keun, Maeng, Jong Sun

Materials Research Society
3 Conference Proceedings Experimental Characterization Of The Reliability Of 3-Terminal Dual-Damascene Copper Interconnect Trees

Gan, C.L., Thompson, C.V., Pey, K.L., Choi, W.K., Wei, F., Yu, B., Hau-Riege, S.P.

Materials Research Society
9 Conference Proceedings Arrayed Si/SiGe Nanowire Heterostructure Formation via Au-catalyzed Wet Chemical Etching Method

X. Wang, K.L. Pey, W. Choi, C. Ho, E.A. Fitzgerald

Electrochemical Society
4 Conference Proceedings Multi-Via Electromigration Test Structures for Identification and Characterization of Different Failure Mechanisms

Choi, Z.-S., Chang, C.W., Lee, J.H., Gan, C.L., Thompson, C.V., Pey, K.L., Choi, W.K.

Materials Research Society
10 Conference Proceedings A Novel Approach to Reduce Via Corner Faceting in the Via-First, No Middle Stop Layer Dual Damascene Trench Etch

Kim, Y-S., Doan, K.L., Bjorkman, C., Paterson, A., Sui, Z., Shan, H.

Electrochemical Society
5 Conference Proceedings Experimental Characterization of the Reliability of Multi-Terminal Dual-Damascene Copper Interconnect Trees

Gan, C. L., Thompson, C. V., Pey, K. L., Choi, W. K., Chang, C. W., Guo, Q.

Materials Research Society
11 Conference Proceedings Study of Ge Out-Diffusion During Nickel (Platinum 〜 0, 5, 10 at.%) Germanosilicide Formation

Jin, L.J., Pey, K.L., Choi, W.K., Fitzgerald, E.A., Antoniadis, D.A., Pitera, A.J., Lee, M.L., Chi, D.Z.

Materials Research Society
6 Conference Proceedings Estimation of the area of voids in deep-submicron aluminium interconnects using resistance-noise measurements

Chu,L.W., Pey,K.L., Chim,W.K., Loh,S.K., Er,E.

SPIE-The International Society for Optical Engineering
12 Conference Proceedings Optimization of align marks and overlay targets in VIA first dual damascene process

Shin, D.-U., Jeong, Y.-B., Park, J.-L., Choi, J.-S., Lee, J.-G., Lee, D.-H.

SPIE-The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12