Evaluation of Thin Dielectric-Glue Wafer-Bonding for Three Dimensional Integrated Circuit-Applications
- Author(s):
Kwon, Y. Yu, J. McMahon, J.J. Lu, J.-Q. Cale, T.S. Gutmann, R.J. - Publication title:
- Materials, technology and reliability for advanced interconnects and low-k dielectrics - 2004 : symposium held April 13-15, 2004, San Francisco, California, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 812
- Pub. Year:
- 2004
- Page(from):
- 321
- Page(to):
- 326
- Pages:
- 6
- Pub. info.:
- Warrendale: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558997622 [1558997628]
- Language:
- English
- Call no.:
- M23500/812
- Type:
- Conference Proceedings
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