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Evaluation of Thin Dielectric-Glue Wafer-Bonding for Three Dimensional Integrated Circuit-Applications

Author(s):
Kwon, Y.
Yu, J.
McMahon, J.J.
Lu, J.-Q.
Cale, T.S.
Gutmann, R.J.
1 more
Publication title:
Materials, technology and reliability for advanced interconnects and low-k dielectrics - 2004 : symposium held April 13-15, 2004, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
812
Pub. date:
2004
Page(from):
321
Page(to):
326
Pages:
6
Pub. info.:
Warrendale: Materials Research Society
ISSN:
02729172
ISBN:
9781558997622 [1558997628]
Language:
English
Call no.:
M23500/812
Type:
Conference Proceedings

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