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Evaluation of PECVD Deposited Boron Nitride as Copper Diffusion Barrier on Porous Low-k Materials

Author(s):
Publication title:
Materials, technology and reliability for advanced interconnects and low-k dielectrics - 2004 : symposium held April 13-15, 2004, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
812
Pub. Year:
2004
Page(from):
147
Page(to):
152
Pages:
6
Pub. info.:
Warrendale: Materials Research Society
ISSN:
02729172
ISBN:
9781558997622 [1558997628]
Language:
English
Call no.:
M23500/812
Type:
Conference Proceedings

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