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Characterization of Structural Quality of Bonded Silicon-on-Insulator Wafers by Spectroscopic Ellipsometry and Raman Spectroscopy

Author(s):
Nguyen, N.V.
Maslar, J.E.
Kim, Jin-Yong
Han, Jin-Ping
Park, Jin-Won
Chandler-Horowitz, D.
Vogel, E.M.
2 more
Publication title:
High-mobility group-IV materials and devices : symposium held April 13-15, 2004, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
809
Pub. date:
2004
Page(from):
127
Page(to):
132
Pages:
6
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558997592 [1558997598]
Language:
English
Call no.:
M23500/809
Type:
Conference Proceedings

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