Stress Metrology : The Challenge for the Next Generation of Engineered Wafers
- Author(s):
Tiberi, Antoine Paillard, Vincent Aulnette, Cecile Daval, Nicolas Bourdelle, Konstantin K. Moreau, Myriam Kennard, Mark Cayrefourcq, Ian - Publication title:
- High-mobility group-IV materials and devices : symposium held April 13-15, 2004, San Francisco, California, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 809
- Pub. Year:
- 2004
- Page(from):
- 97
- Page(to):
- 102
- Pages:
- 6
- Pub. info.:
- Warrendale, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558997592 [1558997598]
- Language:
- English
- Call no.:
- M23500/809
- Type:
- Conference Proceedings
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