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Strained Silicon on Insulator Wafers Made by the Smart CutTM Technology

Author(s):
Ghyselen, B.
Bogumilowicz, Y.
Aulnette, C.
Abbadie, A.
Osternaud, B.
Besson, P.
Daval, N.
Andrieu, F.
Cayrefourq, I.
Moriceau, H.
Ernst, T.
Tiberj, A.
Rayssac, O.
Blondeau, B.
Mazure, C.
Lagahe-Blanchard, C.
Pocas, S.
Cartier, A.-M.
Hartmann, J.-M.
Leduc, P.
Nardo, C.Di
Lugand, J.-F.
Fournel, F.
Semeria, M.-N.
Kernevez, N.
Campidelli, Y.
Kermarrec, O.
Morand, Y.
Rivoire, M.
Bensahel, D.
Paillard, V.
Vincent, L.
Claverie, A.
Boucaud, P.
29 more
Publication title:
High-mobility group-IV materials and devices : symposium held April 13-15, 2004, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
809
Pub. date:
2004
Page(from):
83
Page(to):
88
Pages:
6
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558997592 [1558997598]
Language:
English
Call no.:
M23500/809
Type:
Conference Proceedings

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