High-Density, Low-Loss MOS Decoupling Capacitors Integrated in a GSM Power Amplifier

High-Density, Low-Loss MOS Decoupling Capacitors Integrated in a GSM Power Amplifier

Author(s):

Roozeboom, F.

Publication title:

Materials, integration and packaging issues for high-frequency devices

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

783

Pub. Year:

2004

Page(from):

157

Page(to):

164

Pages:

8

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558997219 [1558997210]

Language:

English

Call no.:

M23500/783

Type:

Conference Proceedings

Details

TDL ID:	ZA00014440
Series ID:	PA00000011
Conf. info. (Name):	Materials, Integration and Packaging Issues for High-Frequency Devices : Symposium
Conf. info. (Number):	2nd
Conf. info. (Venue):	Boston, MA, USA
Conf. info. (Date):	2004.11.29-2004.12.01

Similar Items:

1 Conference Proceedings High-Density, Low-Loss MOS Capacitors for Integrated RF Decoupling Roozeboom, F., Elfrink, R.J.G., Rijks, G.S.M., Th, Verhoeven, J.F.C.M., Kemmeren, A., van den Meerakker, J.E.A.M. IMAPS	7 Conference Proceedings Low Impedance Thin Film Decoupling Capacitor for High Speed Digital Circuits Konushi, S., Nagakari, S., Takafuji, J., Fukumaru, F., Nambu, S. IMAPS
2 Conference Proceedings Extremely High-Density Capacitors with ALD High-k Dielectric Layers Klootwijk, J., Kemmeren, A., Wolters, R., Roozeboom, F., Verhoeven, J., Van Den Heuvel, E. Springer	8 Conference Proceedings Integrated Decoupling Capacitors Using Pb(Zr,Ti)O3 Thin Films Dimos, D., Lockwood, S. J., Garino, T. J., Al-Shareef, H. N., Schwartz, R. W. MRS - Materials Research Society
3 Conference Proceedings ALD Options for Si-integrated Ultrahigh-density Decoupling Capacitors in Pore and Trench Designs F. Roozeboom, J. Klootwijk, J. Verhoeven, E. van den Heuvel, W. Dekkers Electrochemical Society	9 Conference Proceedings Low Temperature Process for High Density Thin Film Integrated Capacitors Hendrix,Bryan C., Stauf,Gregory T. IMAPS, SPIE-The International Society for Optical
4 Conference Proceedings More Than 'Moore': Towards Passive and Si-Based System-In-Package Integration (Invited) Roozeboom, F., Kemmeren, A.L.A.M., Verhoeven, J.F.C., van, F.C., Heuvel, den, Klootwijk, J., Kretschman, H., Fric, T., … Electrochemical Society	10 Conference Proceedings High-power fiber lasers and amplifiers (Invited Paper) Tunnermann, A., Hofer, S., Liem, A., Limpert, J., Reich, M., Roser, F., Schreiber, T., Zellmer, H. SPIE - The International Society of Optical Engineering
5 Conference Proceedings Silicon Based System-in-Package: Breakthroughs in Miniaturization and 'Nano'-Integration Supported by Very High Quality Passives and System Level Design Tools Franck Murray, Francois LeCornec, Serge Bardy, Catherine Bunel, Jan Verhoeven, F. C. M. van den Heuvel, J. H. Klootwijk, … Materials Research Society	11 Conference Proceedings Remote Plasma and Thermal ALD of Al2O3 for Trench Capacitor Applications H. van Hemmen, S. Heil, J. Klootwijk, F. Roozeboom, C. Hodson Electrochemical Society
6 Conference Proceedings Silicon Based System-in-Package : Breakthroughs in Miniaturization and 'Nano'-Integration Supported by Very High Quality Passives and System Level Design Tools Franck Murray, Francois LeCornec, Serge Bardy, Catherine Bunel, Jan Verhoeven, F. C. M. van den Heuvel, J. H. Klootwijk, … Materials Research Society	12 Conference Proceedings Barium Strontium Titanate Thin Film Capacitors for Low Inductance Decoupling Applications Baniecki, J. D., Shioga, T., Kurihara, K. Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12