Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow

Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow

Author(s):

Publication title:

Eco-materials processing & design VI : proceedings of the 6th International Symposium on Eco-Materials Processing & Design, January 16-18, 2005, Jinju, Korea

Title of ser.:

Materials science forum

Ser. no.:

486-487

Pub. Year:

2005

Page(from):

289

Page(to):

292

Pages:

4

Pub. info.:

Uetikon-Zuerich, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499663 [0878499660]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00014243
Series ID:	PA00000012
Conf. info. (Name):	International Symposium on Eco-Materials Processing & Design : ISEPD
Conf. info. (Number):	6th
Conf. info. (Venue):	Jinju, Korea
Conf. info. (Date):	2005.01.16-2005.01.18

Similar Items:

1 Conference Proceedings Influence of Shear Speed on the Shear Force of Eutectic Sn-Pb and Pb-Free BGA Solder Joints Kim, J.W., Yoon, J.W., Jung, S.B. Trans Tech Publications	7 Conference Proceedings Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging Kim, D. G., Jang, H. S., Kim, Y. J., Jung, S. B. Trans Tech Publications
2 Conference Proceedings TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate Yoon, J.W., Jung, S.B. Trans Tech Publications	8 Conference Proceedings A Study on Interfacial Reaction between Electroless Plated Ni-P/Au UBM and Sn-Bi Eutectic Solder Using AEM Choi, J.K., Kang, H.B., Lee, J.W., Jung, S.B., Yang, C.W. Trans Tech Publications
3 Conference Proceedings Effects of Void Formation within the Pb-Free BGA Solder Balls on the Mechanical Joint Strength Kim, J.W., Jung, S.B. Trans Tech Publications	9 Conference Proceedings Bending Fatigue Characteristic of Sn-3.5Ag Solder Bump on Ni-UBM K.I. Kang, J.P. Jung, W.H. Bang, J.H. Park, K.H. Oh Trans Tech Publications
4 Conference Proceedings Optimum Shear Height for Evaluation of Pb-Free Solder Ball Shear Strength Kim, J. W., Park, S. K., Jung, S. B. Trans Tech Publications	10 Conference Proceedings Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag (-Co) Solder H. Nishikawa, A. Komatsu, T. Takemoto Trans Tech Publications
5 Conference Proceedings Interfacial Reaction and Joint Strength on Cu UBM with Pb-Free Flip Chip Solder Bumps Kim, D.G., Ha, S.S., Jung, S.B. Trans Tech Publications	11 Conference Proceedings Effect of Laser Parameter on the Bond Characteristics of Sn-3.5%Ag Solder Ball J.O. Kim, J.P. Jung, J.H. Lee, J. Suh, H.S. Kang Trans Tech Publications
6 Conference Proceedings Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and Electroless Ni-P/Cu Substrate by Solid-State Isothermal Aging Yoon, J.W., Lee, C.B., Jung, S.B. Trans Tech Publications	12 Conference Proceedings DEPENDENCE OF Cu/Sn AND Cu/60Sn40Pb SOLDER JOINT STRENGTH ON DIFFUSION CONTROLLED GROWTH OF Cu3Sn AND Cu6Sn5 Dunn, D. S., Marinis, T. F., Sherry, W. M., William, C. J. Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12