The Evaluation of Adhesion Energy in Thin Compressively Stressed Film by Using Delamination Buckle and Freehanging Buckle

The Evaluation of Adhesion Energy in Thin Compressively Stressed Film by Using Delamination Buckle and Freehanging Buckle

Author(s):

Publication title:

PRICM 5 : the Fifth Pacific Rim International Conference on Advanced Materials and Processing, November 2-5, 2004, Beijing, China

Title of ser.:

Materials science forum

Ser. no.:

475-479(5)

Pub. Year:

2005

Page(from):

3661

Page(to):

3664

Pages:

4

Pub. info.:

Uetikon-Zuerich: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499601 [0878499601]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00014239
Series ID:	PA00000012
Conf. info. (Name):	PRICM : Pacific Rim International Conference on Advanced Materials and Processing
Conf. info. (Number):	5th
Conf. info. (Venue):	Beijing, China
Conf. info. (Date):	2004.11.02-2004.11.05

Similar Items:

1 Conference Proceedings The Evaluation of the Elastic Property in Nano-Scaled Thin Compressive Film on Patterned Substrates Moon, M. W., Kim, Y. Y., Lee, K. R., Oh, K. H. Trans Tech Publications	7 Conference Proceedings Hot-Carrier Degradation Behavior in Thin-Film SOT nMOSFETs With LOCOS and STI Lee, J-W, Kim, H-K, Lee, W-H, Oh, M-R, Kob, Y-H Electrochemical Society
2 Conference Proceedings The Thermal Annealing Effect on the Residual Stress and Mechanical Property in the Compressive Stressed DLC Film Choi, H. W., Moon, M. W., Kim, T. Y., Lee, K. R., Oh, K. H. Trans Tech Publications	8 Conference Proceedings Effect of Buried Oxide on Reliability of Thin-Film SOI nMOSFETs Kim, H-K, Lee, J-W, Lee, W-H, Oh, M-R, Koh, Y-H Electrochemical Society
3 Conference Proceedings Evaluation of SOI wafers using C-V characteristics of thin-film MOS capacitor Lee, J.W., Yang, J.W., Lee, W.C., Oh, M.R., Koh, Y.H. Electrochemical Society	9 Conference Proceedings Mechanics of thin film adhesion-delamination subjected to residual stress and interfacial adhesion: application to MEMS-RF-switch M. F. Wong, K.-T. Wan SPIE - The International Society of Optical Engineering
4 Conference Proceedings The Thermal Annealing Effect on the Residual Stress and Interface Adhesion in the Compressive Stressed DLC Film Choi, Heon Woong, Moon, Myoung-Woon, Kim, Tae-Young, Lee, Kwang-Ryeol, Oh, Kyu Hwan Materials Research Society	10 Conference Proceedings Delamination and Buckling Induced by Compressive Strain in Metal Thin Films Shen, Y. G. Trans Tech Publications
5 Conference Proceedings FRICTIONAL EFFECTS IN THE BUCKLING DELAMINATION OF A COMPRESSED THIN FILM AND IMPLICATIONS FOR INTERFACIAL FRACTURE Stringfellow, R. G., Freund, L. B. Materials Research Society	11 Conference Proceedings Macro Stress Mapping on Thin Film Buckling Goudeau, P., Villain, P., Renault, P.-O., Tamura, N., Celestre, R.S., Padmore, H. Trans Tech Publications
6 Conference Proceedings Optical switch driven by giant magnetostrictive thin films Moon,S.W., Lim,S.H., Lee,S.B., Kang,H.K., Kim,M.C., Han,S.H., Oh,M.H. SPIE - The International Society for Optical Engineering	12 Conference Proceedings AFM Studies on the Effect of Crystalline Interphase on Adhesion of Polyurethane Thin Film to Al Substrate J.S. Kim, O.H. Lee, Y.S. Lim Trans Tech Publications

1

2

3

4

5

6

7

8

9

10

11

12