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Microstructure and High-Temperature Creep Behavior of NiAl-25 at.% Cr Intermetallic Compound

Author(s):
Publication title:
PRICM 5 : the Fifth Pacific Rim International Conference on Advanced Materials and Processing, November 2-5, 2004, Beijing, Chin
Title of ser.:
Materials science forum
Ser. no.:
475-479(1)
Pub. Year:
2005
Page(from):
771
Page(to):
774
Pages:
4
Pub. info.:
Uetikon-Zuerich: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878499601 [0878499601]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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