Blank Cover Image

Investigation on Material Removal Rate in Rotation Grinding for Large-Scale Silicon Wafer

Author(s):
Publication title:
Advances in Materials Manufacturing Science and Technology : selected papers from the 11th International Manufacturing Conference in China September 18th-20th, 2004, Jinan, China
Title of ser.:
Materials science forum
Ser. no.:
471-472
Pub. Year:
2004
Page(from):
362
Page(to):
368
Pages:
7
Pub. info.:
Zurich: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878499564 [0878499563]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

Su, J. X., Guo, D. M., Kang, R. K., Jin, Z. J., Li, X. J., Tian, Y. B.

Trans Tech Publications
7 Conference Proceedings Prediction of Surface Quality for Silicon Carbide Wheel Grinding of Silicon Nitride

L.M. Xu, A.J. Shih, B. Shen, C.X. Ma, D.J. Hu

Trans Tech Publications
2 Conference Proceedings Experimental Research on Dressing Parameters of the Plate in Planetary Double-Sided Grinding Process

D.B. Song, X.L. Zhu, R.K. Kang, Z.J. Jin, S.J. Shi, B. Zhang

Trans Tech Publications
8 Conference Proceedings Fast Melting and Refining of Recycled Silicon Powders from the Wafer Back Grinding Process for Solar Cell Feedstock

K.H. Seo, B.H. Kang, K.Y. Kim

Trans Tech Publications
3 Conference Proceedings Analysis on Contact Forms of Interface in Wafer CMP Based on Lubricating Behavior

S.F. Zhang, J.X. Su, J.X. Du, R.K. Kang

Trans Tech Publications
9 Conference Proceedings Investigation of the Electrical Properties of Bonded Silicon-on-Isolator Wafers

Bailey, P.T, Jin, G., Armstrong, B.M., Gamble, H.S.

Electrochemical Society
4 Conference Proceedings Research on 2×1 plasma electrode electro-optical switch with large aperture

Zhang, X. J., Zheng, K. X., Feng, B., Wu, D. S., Lu, J. P., Tian, X. L., Jin, F., Sui, Z., Wei, X., Zhang, X.

SPIE - The International Society of Optical Engineering
10 Conference Proceedings Grindability Evaluation of Advanced Ceramics

Yu, A. B., Zhong, L. J., Tian, X. L.

Trans Tech Publications
5 Technical Paper An Experimental Investigation of Material Removal Rate in Polishing of Silicon Wavers.

Zhang, X.H., Pei, Z.J., Esayanur, M., Bowers, G.L., Fisher, G.R.

Society of Manufacturing Engineers
11 Conference Proceedings Laser-induced particle removal from silicon wafers

Leiderer,P., Boneberg,J., Dobler,V., Mosbacher,M., Munzer,H.-J., Chaoui,N., Siegel,J., Solis,J., Afnso,C.N., …

SPIE - The International Society for Optical Engineering
6 Conference Proceedings Research on deterministic precision grinding on large-scale K9 optics [6149-88]

Lei X Y, Wanbg J, Xu Q, Guo Z Z

SPIE - The International Society of Optical Engineering
12 Conference Proceedings Modeling of Back Pressure Distribution on the Wafer Loaded in a Multi-Zone Carrier in Chemical Mechanical Polishing

Y.H. Sun, R.K. Kang, D.M. Guo

Trans Tech Publications
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12