Blank Cover Image

Removal Rate, Uniformity and Defectivity Studies Of Chemical Mechanical Polishing of BPSG Films

Author(s):
Publication title:
Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
612
Pub. Year:
2001
Page(from):
D11.6/E8.6
Pub. info.:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558995208 [155899520X]
Language:
English
Call no.:
M23500/612
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Removal Rate, Uniformity and Defectivity Studies of Chemical Mechanical Polishing of BPSG Films

Bonner, Benjamin A., Fishkin, Boris, David, Jeffrey, Garretson, Chad, Osterheld, Thomas H.

Materials Research Society
7 Conference Proceedings Study on Chemical-Mechanical Polishing of Low Dielectric Constant Polyimide Thin Films

Tai, Y.L., Tsai, M.S., Tung, I.C., Dai, B.T., Feng, M.S.

Electrochemical Society
2 Conference Proceedings A Novel Retaining Ring in Advanced Polishing Head Design for Significantly Improved CMP Performance

Bennett, D., Bonner, B., Garretson, C., Huey, S., Jin, R. R., McKeever, P., Osterheld, T. H., Zuniga, S.

Materials Research Society
8 Conference Proceedings Mechanisms of Copper Removal during Chemical Mechanical Polishing

flu, T, Desai, V., Ta, D., Cliathapuram, nboli; V., Sundaram, K.B.

Electrochemical Society
3 Conference Proceedings Using Wafer-Scale Patterns for CMP Analysis

Lee, B., Gan, T., Boning, D.S., David, J., Bonner, B.A., McKeever, P., Osterheld, T.H.

Materials Research Society
9 Conference Proceedings *CHEMICAL MECHANICAL POLISHING OF INTERLEVEL DIELECTRICS: MODELS FOR REMOVAL RATE AND PLANARITY

Sivaram,. S., Tolles, R., Bath, H., Lee, E., Leggett

Materials Research Society
4 Conference Proceedings Effect of Process Parameters on Material Removal Rate in Chemical Mechanical Polishing of 6H-SiC(0001)

J.H. An, G.S. Lee, W.J. Lee, B.C. Shin, J.D. Seo

Trans Tech Publications
10 Conference Proceedings Tuning the Removal Rate of Carbon Doped Oxide during Chemical Mechanical Polishing

Z. Liu, J. Bian

Electrochemical Society
5 Conference Proceedings Copper Removal from Chemical Mechanical Polishing Effluent

Riley, C., Filson, J., Mendicino, L., Brown, P.T.

Electrochemical Society
11 Conference Proceedings Quantitative optical parameter determination in tissues using diffuse photon-density waves:the impact of measurement geometry and source modulation frequency

Spott,T., Pham,T.H., Svaasand,L.O., Fishkin,J.B., Tromberg,B.J.

SPIE - The International Society for Optical Engineering
6 Conference Proceedings Modeling of the removal rate in chemical mechanical polishing

Nguyen,V.H., Shi,F.G.

SPIE-The International Society for Optical Engineering
12 Conference Proceedings Reflectance tomography of two-layered turbid media with diffuse photon-density waves

Spott,T., Svaasand,L.O., Fishkin,J.B., Pham,T.H., Tromberg,B.J.

SPIE - The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12