Microtexture And Strain In Electroplated Copper Interconnects

Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

612

Pub. Year:

2001

Page(from):

D10.3/G7.3

Pub. info.:

Warrendale, PA: Materials Research Society

ISSN:

02729172

ISBN:

9781558995208 [155899520X]

Language:

English

Call no.:

M23500/612

Type:

Conference Proceedings

Details

TDL ID:	ZA00014200
Series ID:	PA00000011
Conf. info. (Name):	Symposium on materials, technology and reliability for advanced interconnects and low-k dielectrics
Conf. info. (Number):	2000
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	2000.04.23-2000.04.27

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