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Seed-Layer Deposition For Sub 0.25 Micron Cu Metallization Using A Line Cusp Magnetron Plasma Source

Author(s):
Wickramanayaka, S.
Nagahama, H.
Watanabe, E.
Hayashi, T.
Sato, M.
Nakagawa, Y.
Hasegawa, S.
Mizuno, S.
Numasawa, Y.
4 more
Publication title:
Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
612
Pub. Year:
2001
Page(from):
D6.3
Pub. info.:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558995208 [155899520X]
Language:
English
Call no.:
M23500/612
Type:
Conference Proceedings

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