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Fabrication Of Air-Gaps Between Cu Interconnects For Low Intralevel k

Author(s):
Bhusari, D.M.
Wedlake, M.D.
Kohl, P.A.
Case, C.
Klements, F.P.
Miner, J.
Lee, B.
Gutmann, R.J.
Lee, J.J.
Shick, R.
Rhodes, L.
6 more
Publication title:
Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
612
Pub. Year:
2001
Page(from):
D4.8
Pub. info.:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558995208 [155899520X]
Language:
English
Call no.:
M23500/612
Type:
Conference Proceedings

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