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Integration And Characterization Of Low Carbon Content SiOxCyHz Low-k Materials For < 0.18μm Dual Damascene Application

Author(s):
Lee, J-H.
Chopra, N.
Ma, J.
Lu, Y-C.
Huang, T-F.
Wilecke, R.
Yau, W-F.
Cheung, D.
Yieh, E.
4 more
Publication title:
Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
612
Pub. Year:
2001
Page(from):
D3.4
Pub. info.:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558995208 [155899520X]
Language:
English
Call no.:
M23500/612
Type:
Conference Proceedings

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