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A Quantitative Study Of The Adhesion Between Copper, Barrier And Organic Low-k Materials

Author(s):
Lanckmans, F.
Brongersma, S.
Varga, I.
Bender, H.
Beyne, E.
Maex, K.
1 more
Publication title:
Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
612
Pub. Year:
2001
Page(from):
D1.4
Pub. info.:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558995208 [155899520X]
Language:
English
Call no.:
M23500/612
Type:
Conference Proceedings

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