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PCA Characterization of Residual Subsurface Damage After Silicon Wafer Mirror Polishing and its Removal

Author(s):
Publication title:
Chemical mechanical polishing -- fundamentals and challenges : symposium held April 5-7, 1999, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
566
Pub. Year:
2000
Page(from):
261
Page(to):
266
Pages:
6
Pub. info.:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558994737 [1558994734]
Language:
English
Call no.:
M23500/566
Type:
Conference Proceedings

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