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Modeling the Influence of Pad Bending on the Planarization Performance During CMP

Author(s):
Devriendt, K.
Fyen, W.
Grillaert, J.
Heylen, N.
Heyns, M.
Meuris, M.
Vrancken, E.
2 more
Publication title:
Chemical mechanical polishing -- fundamentals and challenges : symposium held April 5-7, 1999, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
566
Pub. Year:
2000
Page(from):
45
Page(to):
50
Pages:
6
Pub. info.:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558994737 [1558994734]
Language:
English
Call no.:
M23500/566
Type:
Conference Proceedings

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