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Characterization of Thin Dielectric Films as Copper Diffusion Barriers Using Triangular Voltage Sweep

Author(s):
Armbrust, D.
Cohen, S. A.
Gates, S. M.
Gignac, L.
Ivers, T.
Liu, J.
Rodbell, K. P.
2 more
Publication title:
Low-dielectric constant materials V : symposium held April 5-8, 1999, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
565
Pub. Year:
1999
Page(from):
189
Page(to):
196
Pages:
8
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558994720 [1558994726]
Language:
English
Call no.:
M23500/565
Type:
Conference Proceedings

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