Integration Challenges of Inorganic Low-K (K < 2.5) Materials With Cu for Sub-0.25)μm Multilevel Interconnects

Integration Challenges of Inorganic Low-K (K < 2.5) Materials With Cu for Sub-0.25)μm Multilevel Interconnects

Author(s):

Publication title:

Low-dielectric constant materials V : symposium held April 5-8, 1999, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

565

Pub. Year:

1999

Page(from):

151

Page(to):

160

Pages:

10

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558994720 [1558994726]

Language:

English

Call no.:

M23500/565

Type:

Conference Proceedings

Details

TDL ID:	ZA00014191
Series ID:	PA00000011
Conf. info. (Name):	Symposium on low-dielectric constant materials
Conf. info. (Number):	5th
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	1999.04.05-1999.04.08

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