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Multilevel Damascene Interconnection in Integration of MOCVD Cu and Low-K Fluorinated Amorphous Carbon

Author(s):
Evans, D. R.
Hsu, S-T.
Nguyen, T.
Stecker, L. H.
Ulrich, B.
Yang, H.
1 more
Publication title:
Low-dielectric constant materials V : symposium held April 5-8, 1999, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
565
Pub. Year:
1999
Page(from):
129
Page(to):
136
Pages:
8
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558994720 [1558994726]
Language:
English
Call no.:
M23500/565
Type:
Conference Proceedings

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